We made a performance comparison table based on
the power comparison result between our products and counterparts
of competitors. This our own test requires far severer condition
than normal condition.
![ePCSA-500P-X2S](images/img_2-5_1.gif)
![PC1U-300P-E2S](images/img_2-5_2.gif)
![PC1U-210P-X2S](images/img_2-5_3.gif)
![Result](images/img_2-5_4.gif)
"Purpose of this test"
<< Input voltage ON-OFF at high temperature test
>>
To screen weak points in terms of circuit and design repeatedly
giving max. and min. of input voltage under severe condition of
load and temperature.
<< Load ON-OFF at high at high temperature test >>
To screen weak point and component damage due to bias magnetism,
etc. by repeating ON-OFF of load under severe condition of temperature,
load and input voltage to induce disturbance of feed back loop inside
the power supply.
<< Excessive input voltage test >>
To screen weak points against excessive input voltage in terms of
circuit and design by repeatedly increasing input voltage 120% of
240V during operation, and giving the same voltage at the startup.
<< Overload at high temperature test >>
To screen week points against excess load and temperature in terms
of circuit and design under severe temperature condition giving
110% and 120% of continuous rated load for 1 hour and a half continuously
for each.
<< Low input voltage at high temperature test >>
To screen damages induced by heat-increase due to shortage of driving
power in switching circuit, by decreasing input voltage in ling
term under severe temperature condition.
<< Excess temperature test >>
To screen week points against long term operation in terms of circuit
and design under severe temperature condition.
<< Input impulse test >>
To screen weak points in terms of circuit and design by applying
input voltage of 3 times as long as normal test time.
<< Electrostatic test >>
To screen weak points in terms of circuit and design by increasing
discharge voltage approx. 3 times as long as normal test.
<< Energizing with vibration test >>
To screen weak points in terms of structure and design by giving
3 times as long as normal test.
<< Resonant vibration test >>
To screen weak points in terms of structure and design by giving
excessive load at resonance point amplitude.
<< Lightning surge test >>
To screen weak points in terms of structure and design by applying
2 times as high voltage as normal test.
<< Transceiver test >>
To screen weak points in terms of circuit and design by placing
antenna of transceiver as noise source as close as possible to input/output
of section of power supply.
<< Combined random test >>
To screen weak points in terms of circuit, structure and design
by implementing individual tests at a time to generate far severer
condition than actual operating status.
|