We made a performance comparison table based on the power comparison result between our products and counterparts of competitors. This our own test requires far severer condition than normal condition.

"Purpose of this test"

<< Input voltage ON-OFF at high temperature test >>
To screen weak points in terms of circuit and design repeatedly giving max. and min. of input voltage under severe condition of load and temperature.

<< Load ON-OFF at high at high temperature test >>
To screen weak point and component damage due to bias magnetism, etc. by repeating ON-OFF of load under severe condition of temperature, load and input voltage to induce disturbance of feed back loop inside the power supply.

<< Excessive input voltage test >>
To screen weak points against excessive input voltage in terms of circuit and design by repeatedly increasing input voltage 120% of 240V during operation, and giving the same voltage at the startup.

<< Overload at high temperature test >>
To screen week points against excess load and temperature in terms of circuit and design under severe temperature condition giving 110% and 120% of continuous rated load for 1 hour and a half continuously for each.

<< Low input voltage at high temperature test >>
To screen damages induced by heat-increase due to shortage of driving power in switching circuit, by decreasing input voltage in ling term under severe temperature condition.

<< Excess temperature test >>
To screen week points against long term operation in terms of circuit and design under severe temperature condition.

<< Input impulse test >>
To screen weak points in terms of circuit and design by applying input voltage of 3 times as long as normal test time.

<< Electrostatic test >>
To screen weak points in terms of circuit and design by increasing discharge voltage approx. 3 times as long as normal test.

<< Energizing with vibration test >>
To screen weak points in terms of structure and design by giving 3 times as long as normal test.

<< Resonant vibration test >>
To screen weak points in terms of structure and design by giving excessive load at resonance point amplitude.

<< Lightning surge test >>
To screen weak points in terms of structure and design by applying 2 times as high voltage as normal test.

<< Transceiver test >>
To screen weak points in terms of circuit and design by placing antenna of transceiver as noise source as close as possible to input/output of section of power supply.

<< Combined random test >>
To screen weak points in terms of circuit, structure and design by implementing individual tests at a time to generate far severer condition than actual operating status.